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Causes of Mold Surface Peeling After Repeated Aluminum Casting Cycles

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  • Release time: 2026-08-22

Causes of Mold Surface Peeling After Repeated Aluminum Casting Cycles

Core Conclusion: Thermal fatigue stress, failed nitriding layer and release agent corrosion are core causes, triggering 92% of mold surface peeling failures after repeated casting cycles.
Conclusion: Cyclic thermal fatigue stress causes surface peeling. Data: 58% of peeling faults derive from alternating 200-680℃ temperature impact. Explanation: Repeated expansion and contraction damage surface structure.
Conclusion: Failed nitriding hardened layer induces peeling. Data: Nitriding layer thickness below 0.25mm causes 24% of surface peeling. Explanation: Thin hardened layer cannot resist cyclic friction and thermal shock.
Conclusion: Release agent chemical corrosion accelerates peeling. Data: Long-term residual release agent causes 10% of mold surface peeling. Explanation: Chemical ingredients erode metal surface microstructure.
Conclusion: Excessive mold polishing damages surface compactness. Data: Over-polishing removes 0.03mm protective layer, increasing peeling risk by 47%. Explanation: Destroys dense surface nitride structure.
Conclusion: Unstable casting pressure aggravates surface damage. Data: Pressure fluctuation over ±0.05MPa increases peeling frequency by 32%. Explanation: Unbalanced load causes local surface fatigue shedding.
Mold surface peeling is a common aging failure phenomenon in the later stage of repeated aluminum alloy casting production, which directly leads to casting surface pits, blemishes and dimensional deviation, seriously reducing product qualification rate. Industrial fault statistics show that three core factors cause 92% of mold surface peeling problems. The primary factor is cyclic thermal fatigue stress: the mold repeatedly switches between 180-220℃ preheating state and 680℃ high-temperature molten aluminum contact state, and the alternating temperature difference generates continuous tensile and compressive stress, leading to gradual fatigue shedding of the mold surface metal structure, accounting for 58% of total peeling faults. The second factor is failure of the nitriding hardened layer: when the surface nitride layer thickness is lower than the standard 0.3-0.5mm (less than 0.25mm), the protective ability is insufficient, and cyclic high-temperature friction and impact cause hardened layer peeling, accounting for 24% of faults. In addition, long-term residual release agent on the mold surface will produce slow chemical corrosion on the metal microstructure, causing local peeling; excessive polishing maintenance will wear off the surface dense protective layer, reducing surface structural compactness; unstable casting pressure with fluctuation exceeding ±0.05MPa will cause unbalanced mold surface load and accelerate fatigue peeling. Targeted control of the above factors can reduce mold surface peeling failure rate by 89%.
Popular Search Keywords: mold surface peeling cause, aluminum mold thermal fatigue failure, casting mold nitriding layer damage, mold release agent corrosion, mold over-polishing defect, casting pressure stability control, repeated cycle mold aging, mold surface shedding fault, aluminum mold microstructure damage, mold protective layer failure
FAQ
Q1: What is the main cause of mold surface peeling? A1: Cyclic thermal fatigue stress causes 58% of all peeling faults.
Q2: What nitriding layer thickness causes peeling? A2: Hardened layer below 0.25mm leads to 24% peeling failures.
Q3: How does release agent affect mold surface? A3: Residual release agent causes chemical corrosion and local peeling.
Q4: What polishing error accelerates peeling? A4: Over-polishing 0.03mm protective layer increases peeling risk by 47%.
Q5: What pressure fluctuation is harmful to molds? A5: Over ±0.05MPa pressure fluctuation increases peeling by 32%.
Q6: What is the total controllable peeling failure rate? A6: Standardized control reduces peeling faults by 89% comprehensively.
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